ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging technique
Dutch semiconductor equipment giant ASML is expanding into next-generation hybrid bonding, a technique that creates dense electrical connections by directly joining chips or silicon wafers, according to a new report. Major Chinese companies are also adopting the technology to improve chip performan…
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Timeline · 1 report
- 2026-10-16 12:30 · South China Morning Post Tech
ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging technique