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DayOne In Early Talks With Banks for Potential $500 Million Bond

This story is from 2026-10-09. It is preserved in the archive; the latest stories are on the live feed.

DayOne Data Centers Ltd. has been in preliminary talks for weeks with banks about a potential $500 million bond offering, according to people familiar with the matter, as the Singapore-based company ramps up fundraising amid growing demand for artificial intelligence infrastructure.

Read the full story at Bloomberg AI ↗

Timeline · 1 report

  1. 2026-10-09 07:36 · Bloomberg AI
    DayOne In Early Talks With Banks for Potential $500 Million Bond

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