Foxconn targets automotive chiplets with 5 µm fan-out RDL packaging

Foxconn is using fan-out redistribution layer (RDL) technology to enter the advanced packaging market, showcasing roughly 5 µm line-width capability aimed at automotive chiplets as AI expands from cloud training to end devices.

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Timeline · 1 report

2026-11-14 17:59 · DigiTimes Asia
Foxconn targets automotive chiplets with 5 m fan-out RDL packaging

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