Glass substrates emerge as AI chip packaging moves beyond 100x100mm

As AI accelerators grow larger and substrates exceed 100x100mm, warpage in organic substrates is worsening, opening core-layer processes to players beyond traditional substrate makers.

Read the full story at DigiTimes Asia ↗

Timeline · 1 report

2026-11-12 04:48 · DigiTimes Asia
DIGITIMES Insight: Entering glass substrate era, core layers are no longer an exclusive process for substrate makers

More stories

Nvidia Board Meets to Consider Ousting CEO Jensen Huang Amid Scandal Reports — CSET Georgetown
Anthropic IPO Said to Be Multiple Times Oversubscribed as AI Trade Rebounds — CNBC Technology
Anthropic launches Claude Fable 5.2 with lower pricing and top benchmark scores — Anthropic (X)
Google launches Gemini Decisions API with new Decision 1 model for bounded choices — Google Cloud AI Blog
AWS launches local emulator simulating 200+ services, written entirely by AI agents — AWS Machine Learning Blog
Google DeepMind launches AlphaGenome 2 to predict DNA variant effects across cell types — Google DeepMind Blog
Google DeepMind's AlphaProof Code formally verifies Signal's cryptographic code in four weeks — Google DeepMind Blog
AWS launches standalone Web Search API for Amazon Bedrock AgentCore — AWS Machine Learning Blog

Get the daily brief of stories like this at 6:30 every morning →