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GlobalFoundries and TSMC sign $2 billion deal for US silicon interposers in AI packaging

This story is from 2026-10-11. It is preserved in the archive; the latest stories are on the live feed.

GlobalFoundries and TSMC have agreed to a multi-year manufacturing deal that brings production of a critical component for advanced AI chips to the United States. The partnership aims to address a known bottleneck in the semiconductor supply chain for high-performance computing. What Happened On Oc…

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  1. 2026-10-11 10:42 · DEV Community — AI
    GlobalFoundries and TSMC sign $2 billion deal for US silicon interposers in AI packaging

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