HBM5 hybrid bonding, Vera CPU details, and widening wafer penalty dominate Hot Chips 2026

This story is from 2026-08-24. It is preserved in the archive; the latest stories are on the live feed.

At Hot Chips 2026, SK hynix proposed hybrid bonding for HBM5 to address the 775-micron thickness limit, while Nvidia detailed its 88-core Vera CPU with spatial multithreading and 1.2 TB/s SOCAMM2 memory. Micron warned that HBM's silicon penalty versus DDR5 is growing each generation, worsening the memory wall.

Read the full story at Tom's Hardware ↗

Timeline · 3 reports

1. 2026-08-25 12:19 · Tom's Hardware
   Hot Chips 2026: Micron warns HBM wafer penalty is widening with every generation — AI memory uses 3x more silicon than DDR5, company says memory wall is 'getting worse' as prices rise
2. 2026-08-25 11:53 · Tom's Hardware
   Hot Chips 2026: Nvidia breaks down 88-core Vera CPU — spatial multithreading benchmarked, 1.2 TB/s SOCAMM2 memory, agentic workloads detailed, and more
3. 2026-08-24 17:55 · Tom's Hardware
   Hot Chips 2026: SK hynix pushes hybrid bonding to HBM5 as AI memory hits 775-micron ceiling — firm extends MR-MUF through Nvidia Rubin