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Japan says progress made on $550B pact, with AI and chips weighing heavily on the next round

This story is from 2026-09-05. It is preserved in the archive; the latest stories are on the live feed.

Japan’s trade minister said discussions on AI and semiconductors will carry very significant weight in the third tranche of its $550B US investment pact, after two rounds went to energy and minerals. The EU’s own framework contains no comparable vehicle, and commits the bloc to buying at least $40B…

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  1. 2026-09-05 11:35 · The Next Web
    Japan says progress made on $550B pact, with AI and chips weighing heavily on the next round

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