Micron outlines DRAM and NAND roadmap with 3D NAND, High-NA EUV, and custom memory
Micron detailed plans to adopt new technologies in DRAM and 3D NAND, including High-NA EUV lithography and new materials, while reviving custom silicon as custom memory types move toward mainstream use.
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Timeline · 1 report
- 2026-11-04 14:00 · Tom's Hardware
Micron details ambitious DRAM and NAND roadmap — 3D NAND, High-NA EUV, new materials, and custom silicon makes a comeback
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