AINewsnow

'Oxygen tunnel' structure could solve 3D memory reliability problem to boost AI chip performance

This story is from 2026-08-19. It is preserved in the archive; the latest stories are on the live feed.

As AI systems become more advanced, memory is required to transfer larger amounts of data at higher speeds. But conventional planar semiconductor scaling is running out of room. A KAIST research team has now addressed a key weakness in three-dimensional, vertically stacked memory devices, opening a…

Read the full story at TechXplore AI & ML ↗

Timeline · 1 report

  1. 2026-08-19 15:20 · TechXplore AI & ML
    'Oxygen tunnel' structure could solve 3D memory reliability problem to boost AI chip performance

More stories

  1. Trump announces a new 'AI Force,' but says he will not 'stifle' AI — Business Insider AI
  2. Alibaba ships Qwen3.8-Omni-Flash to watch, listen and call tools — r/LocalLLM
  3. Introducing Kimi K3 on Amazon Bedrock — AWS Machine Learning Blog
  4. Introducing Amazon SageMaker HyperPod Inference Gateway — AWS Machine Learning Blog
  5. Anthropic, OpenAI, SpaceXAI, Google sued over call to ‘pace’ AI development — Politico Technology
  6. Google's Gemini AI hacks three other companies during security test — Sky News Technology
  7. Gemini Hacked Three Companies in First Known Breakout by Google’s AI — Wall Street Journal Technology
  8. AI's role in building AI surging? Anthropic says Claude now leads 26% of its R&D — Mint AI

Get the daily brief of stories like this at 6:30 every morning →