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  1. Samsung reportedly wins more AI chip orders from US cloud firms — DigiTimes Asia
  2. SK Hynix and Intel explore shared memory architectures to ease AI bottlenecks — DigiTimes Asia
  3. Samsung expands HBM packaging at Onyang as Cheonan campus runs short of space — DigiTimes Asia
  4. Altman cautions Samsung that AI memory demand may fluctuate in short term — DigiTimes Asia
  5. Samsung advances HBM packaging plant opening to June 2028 — DigiTimes Asia
  6. SK Hynix turns to Nvidia AI and GPUs to accelerate memory chip simulations — DigiTimes Asia
  7. Samsung and Nvidia demonstrate up to 3,800-fold speedup in chip simulation — DigiTimes Asia
  8. Jensen Huang's Nvidia exit reshapes US-China AI chip debate as Anthropic IPO draws demand — CSET Georgetown

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