Taiwan's GIS pivots to 800G/1.6T AI optics with laser packaging ramp from late 2026

GIS is shifting from touch displays to semiconductor optics, targeting 800G/1.6T AI optical products, with laser packaging entering small-volume production in 4Q26 and full capacity by Q2 or Q3 of the following year.

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Timeline · 1 report

2026-11-10 04:21 · DigiTimes Asia
Taiwan's GIS targets 800G/1.6T AI optics, with laser packaging ramp-up starting 4Q26

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