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  1. DEEPX tapes out DX-M2 AI chip on Samsung 2nm process — DigiTimes Asia
  2. Samsung and SK Hynix shift eSSD supply from China to US cloud providers — DigiTimes Asia
  3. Samsung reportedly wins more AI chip orders from US cloud firms — DigiTimes Asia
  4. Samsung expands HBM packaging at Onyang as Cheonan campus runs short of space — DigiTimes Asia
  5. Altman cautions Samsung that AI memory demand may fluctuate in short term — DigiTimes Asia
  6. Samsung advances HBM packaging plant opening to June 2028 — DigiTimes Asia
  7. Samsung and Nvidia demonstrate up to 3,800-fold speedup in chip simulation — DigiTimes Asia
  8. Jensen Huang resigns as Nvidia CEO; CFO Colette Kress named interim chief — CSET Georgetown

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